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HCD-VR50/VR70
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. (In addition to this, the necessary note is printed in each block.) For schematic diagrams.
Note: � All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums. � All resistors are in � and 1/4 W or less unless otherwise specified. � ¢ : internal component. � 2 : nonflammable resistor. � 1 : fusible resistor. � C : panel designation. Note: The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part number specified. � � � � � U : B+ Line. V : B� Line. H : adjustment for repair. Voltages and waveforms are dc with respect to ground under no-signal (detuned) conditions. Voltages are taken with a VOM (Input impedance 10 M�). Voltage variations may be noted due to normal production tolerances. Waveforms are taken with a oscilloscope. Voltage variations may be noted due to normal production tolerances. Circled numbers refer to waveforms. Signal path. F : FM g : VIDEO/MD E : PB (DECK A) d : PB (DECK B) G : REC (DECK B) m : CHROMA n :Y o : VIDEO J : CD c : digital out � Abbreviation EA : Saudi Arabia model. SP : Singapore model. MY : Malaysia model. HK : Hong Kong model. TW : Taiwan model. IA : Indonesian model. TH : Thai model.
WAVEFORMS � CD SECTION � 1
1.3Vp-p
� VIDEO SECTION � 1
4Vp-p
� MAIN (2/5) SECTION � 7
4.6Vp-p
1
5.5Vp-p
10MHz
44.1kHz
16MHz
IC502 !£ XOUT IC101 %º RFAC
IC509 !ª LRCK
IC501 !¡ XC-OUT
2
2.5V H 1Vp-p
8
4.8Vp-p
2
5.2Vp-p
2
2.11MHz
32.768kHz
APPROX 500mVp-p
IC505 &� COUT
IC509 !¶ BCLK
IC501 !£ X-OUT
IC101 $¡ TE
3
2.5V
2Vp-p
9
4.8Vp-p
3 � PANEL FL SECTION � 1
3.4Vp-p
APPROX 200mVp-p
H
33.8MHz
IC505 ^ª YOUT IC101 #ª FE
IC504 8 384FS
4 4
2.6Vp-p
H 1Vp-p
0
12.5MHz
3.8Vp-p
IC601 &� X OUT
�
7.5µsec
IC401 7 COUT
IC504 6 27M
27MHz
IC101 @� MDP
5
2Vp-p
!¡
2.8Vp-p
� �
H
33.8MHz
IC401 1 YOUT
IC504 !�
6
5.8Vp-p 27MHz
IC509 1 XT1
For printed wiring boards.
Note: � X : parts extracted from the component side. � Y : parts extracted from the conductor side. � p : parts mounted on the conductor side. � ® : Through hole. � b : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.) Caution: Pattern face side: (Side B) Parts face side: (Side A)
Parts on the pattern face side seen from the pattern face are indicated. Parts on the parts face side seen from the parts face are indicated.
� Indication of transistor
C Q These are omitted
